High Speed - Vias Under SMD
Created: March 23, 2017 | Updated: September 27, 2019
| Applies to versions: 18.0, 18.1, 19.0, 19.1, 20.0, 20.1 and 20.2
Now reading version 19.0. For the latest, read: High Speed - Vias Under SMD for version 21
Rule category: High Speed
Rule classification: Unary
Summary
This rule specifies whether vias can be placed under SMD pads.
Constraints
- Allow Vias under SMD Pads - specifies whether vias can be placed under the pads of surface mount components.
How Duplicate Rule Contentions are Resolved
All rules are resolved by the priority setting. The system goes through the rules from highest to lowest priority and picks the first one whose scope expression matches the object(s) being checked.
Rule Application
Online DRC, Batch DRC, interactive routing, and autorouting.