High Speed - Vias Under SMD

Created: March 23, 2017 | Updated: September 27, 2019 | Applies to versions: 18.0, 18.1, 19.0, 19.1, 20.0, 20.1 and 20.2

Now reading version 19.0. For the latest, read: High Speed - Vias Under SMD for version 21

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Rule category: High Speed

Rule classification: Unary

Summary Copy Link Copied

This rule specifies whether vias can be placed under SMD pads.

All design rules are created and managed within the PCB Rules and Constraints Editor dialog. For a high-level view of working with the design rules system, see Defining, Scoping & Managing PCB Design Rules.

Constraints Copy Link Copied

Default constraints for the Vias Under SMD rule.

Allow Vias under SMD Pads - specifies whether vias can be placed under the pads of surface mount components.

How Duplicate Rule Contentions are Resolved Copy Link Copied

All rules are resolved by the priority setting. The system goes through the rules from highest to lowest priority and picks the first one whose scope expression matches the object(s) being checked.

Rule Application Copy Link Copied

Online DRC, Batch DRC, interactive routing, and autorouting.

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Content

Summary
Constraints
How Duplicate Rule Contentions are Resolved
Rule Application