Query_Lang-PCBFunctions_Fields_SolderMaskTentingBottomSolderMaskTentingBottom_AD
Created: 6月 23, 2017 | Updated: 6月 23, 2017
| Applies to versions: 18.0, 18.1, 19.0, 19.1, 20.0, 20.1 and 20.2
現在、バージョン 18.0. をご覧頂いています。最新情報については、バージョン Query_Lang-PCBFunctions_Fields_SolderMaskTentingBottom((SolderMaskTentingBottom))_AD の 21 をご覧ください。
Parent page: PCB Query Functions - Fields
Summary
Returns all pad and via objects whose Solder Mask Tenting - Bottom property complies with the Query.
Syntax
SolderMaskTentingBottom : Boolean_String
Example Usage
SolderMaskTentingBottom = 'True'
Returns all pad and via objects whose Solder Mask Tenting - Bottom property is enabled.
SolderMaskTentingBottom = 'False'
Returns all pad and via objects whose Solder Mask Tenting - Bottom property is disabled.
Tips
- The Solder Mask Tenting - Bottom property is only defined for pad and via objects.
- The Solder Mask Tenting - Bottom property (as reflected in the List panels), relates to the Bottom option in the Solder Mask Expansion section, when viewing the properties for a selected object through the Properties panel. When the Solder Mask Tenting - Bottom property is enabled, the Bottom option is disabled, meaning that the pad/via has no solder mask opening on the bottom of the board, and is therefore tented.