ポリゴン接続スタイル設計ルール
Created: 3月 17, 2022 | Updated: 3月 18, 2022
| Applies to version: 21
現在、バージョン 22.0. をご覧頂いています。最新情報については、バージョン ポリゴン接続スタイル設計ルール の 21 をご覧ください。
Rule category: Plane
Rule classification: Binary
Summary
This rule specifies the style of the connection from a component pad, or routed via, to a polygon plane.
Constraints
- Mode of Operation - the rule can operate in one of the following two modes:
- Simple - this mode is the generic setting for how pads/vias connect to a polygon pour, as present in previous versions of the software.
- Advanced - in this mode, you have the ability to define specific thermal connections for thru-hole pads, SMD pads, and vias, separately.
- Connect Style - defines the style of the connection from a pin of a component, targeted by the scope (Full Query) of the rule, to a polygon plane. The following three styles are available:
Relief Connect
- connect using a thermal relief connection.Direct Connect
- connect using solid copper to the pin.No Connect
- do not connect a component pin to the polygon plane.
The following constraints apply only when using the Relief Connect
style:
- Conductors - the number of thermal relief copper connections (2 or 4).
- Conductor Width - how wide the thermal relief copper connections are.
- Angle - the angle of the copper connections (45° or 90°).
- Air Gap Width - the distance between the edge of the pad and the surrounding polygon.
How Duplicate Rule Contentions are Resolved
All rules are resolved by the priority setting. The system goes through the rules from highest to lowest priority and picks the first one whose scope expressions match the object(s) being checked.
Rule Application
During polygon pour.
Notes
- The Simple mode is the default mode, for a newly created rule of this type.
- After setting and applying constraints in Advanced mode, be aware that switching back to Simple mode is considered a modification - clicking Apply or OK will effect the simple definition, overriding the individual advanced definitions specified previously.