SolderMaskTentingBottom
Created: June 23, 2017 | Updated: March 06, 2024
| Applies to versions: 1.0, 1.1, 2.0, 2.1, 3.0, 3.1 and 3.2
Now reading version 3.0. For the latest, read: SolderMaskTentingBottom for version 4
Parent page: PCB Query Functions - Fields
Summary
Returns all pad and via objects whose Solder Mask Tenting - Bottom property complies with the Query.
Syntax
SolderMaskTentingBottom : Boolean_String
Example Usage
SolderMaskTentingBottom = 'True'
Returns all pad and via objects whose Solder Mask Tenting - Bottom property is enabled.
SolderMaskTentingBottom = 'False'
Returns all pad and via objects whose Solder Mask Tenting - Bottom property is disabled.
Tips
- The Solder Mask Tenting - Bottom property is only defined for pad and via objects.
- The Solder Mask Tenting - Bottom property (as reflected in the List panels), relates to the Bottom option in the Solder Mask Expansion section, when viewing the properties for a selected object through the Properties panel. When the Solder Mask Tenting - Bottom property is enabled, the Bottom option is disabled, meaning that the pad/via has no solder mask opening on the bottom of the board, and is therefore tented.