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Ver: Version: 3.2
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High Speed - Vias Under SMD

Created: March 23, 2017 | Updated: September 27, 2019 | Applies to versions: 1.0, 1.1, 2.0, 2.1, 3.0, 3.1 and 3.2
Now reading version 3.2. For the latest, read: High Speed - Vias Under SMD for version 4

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Rule category: High Speed

Rule classification: Unary

Summary

This rule specifies whether vias can be placed under SMD pads.

All design rules are created and managed within the PCB Rules and Constraints Editor dialog. For a high-level view of working with the design rules system, see Defining, Scoping & Managing PCB Design Rules.

Constraints

Default constraints for the Vias Under SMD rule.Default constraints for the Vias Under SMD rule.

  • Allow Vias under SMD Pads - specifies whether vias can be placed under the pads of surface mount components.

How Duplicate Rule Contentions are Resolved

All rules are resolved by the priority setting. The system goes through the rules from highest to lowest priority and picks the first one whose scope expression matches the object(s) being checked.

Rule Application

Online DRC, Batch DRC, interactive routing, and autorouting.

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