ViaSize_MidLayer21
Parent page: PCB Query Functions - Fields
Summary
Returns via objects whose X Size (Mid Layer 21) property complies with the Query.
Syntax
ViaSize_MidLayer21 : Number
Number
will follow the measurement units currently employed for the document – either Imperial (mil; 1mil = 0.001inch) or Metric (mm; 1mm = 0.001meter).
A specific option for the measurement unit can be specified – overriding the default units specified at the document level – through use of an additional measurement unit-based keyword:
AsMils(
ViaSize_MidLayer21
) : Number
– to specify a size in mil.AsMM(
ViaSize_MidLayer21) : Number
– to specify a size in mm.
Example Usage
ViaSize_MidLayer21 = 100
Returns all via objects whose X Size (Mid Layer 21) property is equal to 100 current measurement units.
ViaSize_MidLayer21
>= 4.064
Returns all via objects whose X Size (Mid Layer 21) property is greater than, or equal to, 4.064 current measurement units.
AsMils(ViaSize_MidLayer21) > 80
Returns all via objects whose X Size (Mid Layer 21) property is greater than 80mil.
AsMM(ViaSize_MidLayer21) Between 1.524 And 3.81
Returns all via objects whose X Size (Mid Layer 21) property is greater than or equal to 1.524mm
and less than or equal to 3.81mm
.
ViaSize_MidLayer21 <> 50
Returns all via objects whose X Size (Mid Layer 21) property is not equal to 50 current measurement units.
Tips
- For simple vias (with Stack Mode set to Simple) the X Size (Mid Layer 21) property will be the same as the X Size (All Layers) property, since the specified size is used for all signal layers.
- While the PCB List panel displays the X Size (All Layers) property, the PCB Inspector panel displays this property by another name - Via Diameter.
- For Top-Middle-Bottom vias (with Stack Mode set to Top-Middle-Bottom) the X Size (Mid Layer 21) property will be the same as the X Size (Mid Layer 1) property, since the size specified for Signal Layer 1 is applied to all internal ('middle') signal layers.
- The X Size (Mid Layer 21) property is only defined for pad and via objects.