CompMake_Dlg-PCMWizardDialogPCB Component Wizard_AD

Created: April 05, 2016 | Updated: Juni 19, 2017 | Applies to versions: 15.1, 16.0, 16.1, 17.0 and 17.1

Now reading version 17.0. For the latest, read: CompMake_Dlg-PCMWizardDialog((PCB Component Wizard))_AD for version 18.0

The PCB Component Wizard is used to create a new component footprint within the current PCB Library Editor document. The Wizard will lead you through simple steps to define layout, pad spacing, and other component attributes.

For more information about creating a component Footprint, see the Creating the PCB Footprint page.

Using the PCB Component Wizard

The PCB Component Wizard is launched by clicking Tools » Component Wizard from a PCB Library document (*.PcbLib).

Wizard Navigation

Click Cancel to close the PCB Component Wizard.

To manually create the component footprint without the aid of the Wizard, click Cancel after opening the Wizard and before proceeding beyond this step. A new component footprint will be created and an empty workspace will be opened in the main design window. A default name will be given to the new component in the Components region of the PCB Library panel (e.g., PCBCOMPONENT_1). Use the Component Properties command from the main menu (Tools » Component Properties) or right-click in the PCB Library panel to open the PCB Library Component dialog from where you can change the name as required.

Click Back to navigate to the previous screen.
Click Next to navigate to the next screen.
Click Finish to close the PCB Component Wizard. This option is available only on the final page of the Wizard.

Selecting Component Patterns

Use the Component patterns page to specify the pattern of the component you want to create.

Select the desired pattern from the list then use the drop-down to select the unit for the component (Imperial (mil) or Metric (mm)).

The subsequent pages of the Wizard change depending upon the component pattern selected. Find the desired component pattern in the following list and click on the link to access the information regarding that component pattern.

Ball Grid Arrays (BGA)

To change the pads' diameters, click on the value and enter the new value.

To change the pad to pad distances, click on the values and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select either Alpha Numeric or Numeric naming style.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Capacitors

Use the drop-down to select the type of capacitor you want to design. Choose from Through Hole or Surface Mount.

To change the pads' dimensions, click on the values and enter the new values.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

To change the pads positioning, click on the value and enter the new value.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

This page appears if Through Hole was selected. If Surface Mount was selected, the page below appears.

Use the drop-down to select the capacitor's polarity, either Not Polarised or Polarised. Use the drop-down to select the capacitor's mounting style, either Axial or Radial.

This page appears if Surface Mount was selected.

Use the drop-down to select outline type, either Non polarised Outline or Polarised Outline.

To change the outline dimensions, click on the values and enter the new values.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

Diodes

Use the drop-down to select the type of diode you want to design. Choose from Through Hole or Surface Mount.

To change the pads' dimensions, click on the values and enter the new values.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

To change the pads positioning, click on the value and enter the new value.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

To change the outline dimensions, click on the value and enter the new value.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

Dual In-line Packages (DIP)

To change the pads' dimensions, click on the value and enter the new required value.

To change the pads' layout, click on the value and enter the new required value.

To change the outline width, click on the value and enter the new required value.

Use the up and down arrows to select the total number of pads.

Edge Connectors

To change the pads' dimensions, click on the value and enter the new required value.

To change the pad to pad distance, click on the value and enter the new required value.

Use the up and down arrows to select the number of pads. Click the green arrow to change the naming order. The arrow will dynamically change to display the order.

Leadless Chip Carriers (LCC)

To change the pads' dimensions, click on the value and enter the new required value.

Use the drop-down to choose the pads' shapes. Select from Round or Rectangular for For the first pad, then select Round or Rectangular for For the other pads.

To change the outline width, click on the value and enter the new required value.

To change the pads' positioning, click on the value and enter the new required value.

Click one of the radio buttons to select the first pad's location. Choose the naming direction by clicking on the green arrow. The arrow will dynamically update to display the order.

Use the up and down arrows to select the number of pads for both X and Y.

Pin Grid Arrays (PGA)

To change the pads' dimensions, click on the value and enter the new required value.

To change the pad to pad distances, click on the value and enter the new required value.

To change the outline width, click on the value and enter the new required value.

Use the drop-down to select the pads naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Quad Packs (QUAD)

To change the pads' dimensions, click on the value and enter the new required value.

Use the drop-down to choose the pads' shapes. Select from Round or Rectangular for For the first pad, then select Round or Rectangular for For the other pads.

To change the outline width, click on the value and enter the new required value.

To change the pads' positioning, click on the value and enter the new required value.

Click one of the radio buttons to select the first pad's location. Choose the naming direction by clicking on the green arrow. The arrow will dynamically update to display the order.

Use the up and down arrows to select the number of pads for both X and Y.

Resistors

Defining the Board Technology

Select the type of resistor you want to design from the drop-down. Choices include Through Hole or Surface Mount.

Defining the Pads Dimensions

To change the pads' dimensions, click on the value and enter the new value.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

To change the pad to pad distance, click on the value and enter the new value.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

To change the outline dimensions, click on the value and enter the new value.

This page will have a slightly different look if Surface Mount was selected, however, its functionality is the same.

Small Outline Packages (SOP)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the up and down arrows to select the total number of pads.

Staggered Ball Grid Arrays (SBGA)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select the pads naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Staggered Pin Grid Arrays (SPGA)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select the pads' naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Setting the Component Name

Enter a name for the component in the textbox.

Completing and Closing the Wizard

Click Finish to close the Wizard.

Druckversion

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CompMake_Dlg-PCMWizardDialogPCB Component Wizard_AD

Using the PCB Component Wizard

Wizard Navigation

Selecting Component Patterns

Ball Grid Arrays (BGA)

Capacitors

Diodes

Dual In-line Packages (DIP)

Edge Connectors

Leadless Chip Carriers (LCC)

Pin Grid Arrays (PGA)

Quad Packs (QUAD)

Resistors

Small Outline Packages (SOP)

Staggered Ball Grid Arrays (SBGA)

Staggered Pin Grid Arrays (SPGA)

Setting the Component Name

Completing and Closing the Wizard

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