Query_Lang-PCBFunctions_Fields_SolderMaskTentingBottomSolderMaskTentingBottom_AD
Created: 八月 02, 2022 | Updated: 八月 02, 2022
| Applies to version: 21
This document is no longer available beyond version 21.0. Information can now be found here: SolderMaskTentingBottom for version 25
Parent page: PCB Query Functions - Fields
Summary
Returns all pad and via objects whose Solder Mask Tenting - Bottom property complies with the Query.
Syntax
SolderMaskTentingBottom : Boolean_String
Example Usage
SolderMaskTentingBottom = 'True'
Returns all pad and via objects whose Solder Mask Tenting - Bottom property is enabled.
SolderMaskTentingBottom = 'False'
Returns all pad and via objects whose Solder Mask Tenting - Bottom property is disabled.
Tips
- The Solder Mask Tenting - Bottom property is only defined for pad and via objects.
- The Solder Mask Tenting - Bottom property (as reflected in the List panels), relates to the Bottom option in the Solder Mask Expansion section, when viewing the properties for a selected object through the Properties panel. When the Solder Mask Tenting - Bottom property is enabled, the Bottom option is disabled, meaning that the pad/via has no solder mask opening on the bottom of the board, and is therefore tented.