创建PCB封装

When you make a change to a Workspace domain model – be it a symbol, footprint model, or simulation model – the moment you save that change into a new revision of the model, any Workspace Components that use that model will become effectively out of date, still using the previous revision. In most cases, you will no doubt want to re-save those Workspace Components, with the respective model links updated to use the latest revisions available. To streamline this process, a Workspace, in conjunction with Altium Designer, facilitates the ability to update related components – at the point of re-saving a Workspace model – after having made any modifications to that model through the direct editing feature.

The option to perform this update to the parent components can be found in the Create Revision dialog that appears when saving the modified Workspace Footprint back to the target Workspace. This option – Update items related to <ModelItemRevision> – is enabled by default.

Accessing the option to update related Workspace Components, that are referencing the Workspace Footprint being re-saved.

Once you click OK in the Create Revision dialog, the modified footprint is saved back to the Workspace, and its associated temporary editor is closed. All Workspace Components referencing that Workspace Footprint will be re-saved to use its new revision automatically (the next revision of each component is automatically created and the save performed).

The options in this section of the panel determine which PCB library objects may be selected in the design space.

• All Objects button – select remove object filtering so that all types of objects may be selected.
• Object buttons – toggle each object button to enable/disable the ability to select that object type.

• Grids – used to toggle whether the cursor will snap to the active design space grid. When this option is enabled the cursor will pull, or snap, to the nearest snap grid location. The active snap grid is displayed on the Status bar, and in the PCB editor Heads Up display (Shift+H shortcut to toggle on/off).
• Guides – used to toggle whether the cursor will snap to manually placed linear or point Snap Guides. A Snap Guide will override the Snap Grid.
• Axes – used to toggle whether the cursor will axially align (in either the X or Y direction) to the enabled Objects for snapping. The Axis Snap Range defines the distance within which X or Y axial alignment will occur. A dynamic alignment guideline is displayed when alignment is achieved from the current cursor location to the axially-aligned object snap point (hotspot).
• Snapping – select directly or use the Shift+E shortcut to select whether you want to snap to objects on:
  • All Layers – enable this option to allow the cursor to snap to any electrical object on any visible layer.
  • Current Layer – enable this option to allow the cursor to only recognize and snap to objects placed on the currently selected layer.
  • Off – enable this option to turn off snapping to hotspots.
• Objects for snapping
  • On/Off – check to enable snapping for the desired objects.
  • Objects – a list of the available objects.
• Snap Distance – when the cursor is within this distance from an enabled object snap point (and snapping is enabled for the active layer), the cursor will snap to that point.
• Axis Snap Range – when the cursor is axially aligned and within this distance from an enabled object snap point (and the Axes button is enabled), a dynamic guideline will display to indicate that alignment has been achieved.

• Grid Manager – where local customized grids can be defined and managed, as well as the default Snap Grid for the board.
  • Priority – in the design space, priority is distinguished by drawing order. The highest priority grid (priority 1) will be drawn in front of all other grids, then the grid with priority level 2, etc., down to the default Global Board Snap Grid, which is drawn behind all other custom grids.
  • Name – displays the name of the grid.
  • Color – click to open a drop-down to set/change the color of the associated grid.
  • Enabled – check to enable the associated grid.
• Add
  • Add Cartesian Grid – click to add a Cartesian grid.
  • Add Polar Grid – click to add a Polar grid. Polar grids enable you to more easily design non-rectangular features and boards.
• Properties – click to open the respective grid editor dialog (Cartesian Grid Editor or Polar Grid Editor) to modify properties for the selected grid.
• – click to delete the currently selected grid.

• Guide Manager – where a range of manual Snap Guides and Snap Points for the board can be defined and managed.
  • Enabled – whether the guide is visible in the design space (checked) or not (unchecked).
  • Name – the name of the guide.
  • X – the x-coordinate (where applicable) specified in the design space that the guide is to pass through or point is to be located at.

  • Y – the y-coordinate (where applicable) specified in the design space that the guide is to pass through or point is to be located at.

    A coordinate can be defined by clicking on the relevant field then entering the value. Alternatively, and where applicable/available, click to the right of the field, then specify the required point directly in the PCB Library design space.
  • Color – click to open a drop-down to set/change the color of the associated guide.
• Add – click to add a new snap guide or snap point. Choose the corresponding command for the required guide type from the associated menu; an entry for the new guide/point will be added to the grid. The following guide types are available:
  • Add Horizontal Guide – use this command to add a horizontal guideline at the desired Y-coordinate location in the design space.
  • Add Vertical Guide – use this command to add a vertical guideline at the desired X-coordinate location in the design space.
  • Add +45 Guide – use this command to add a 45 degree (y=x) guideline that passes through the desired X,Y coordinate location in the design space.
  • Add -45 Guide – use this command to add a -45 degree (y=-x) guideline that passes through the desired X,Y coordinate location in the design space.
  • Add Snap Point – use this command to add a point snap guide. This is a hotspot that you manually mark within the confines of the default snap grid. During an interactive process such as placing or moving an object, that objects' hotspot will 'snap' to a point snap guide when it passes into close proximity with it.
• Place – click to place a guide. Select the guide type from the drop-down:
  • Place Horizontal Guide – use this command to place a horizontal guideline at the desired Y-coordinate location in the design space.
  • Place Vertical Guide – use this command to place a vertical guideline at the desired X-coordinate location in the design space.
  • Place +45 Guide – use this command to place a 45 degree (y=x) guideline that passes through the desired X,Y coordinate location in the design space.
  • Place -45 Guide – use this command to place a -45 degree (y=-x) guideline that passes through the desired X,Y coordinate location in the design space.
  • Place Snap Point – use this command to place a point snap guide. This is a hotspot that you manually mark within the confines of the default snap grid. During an interactive process such as placing or moving an object, that objects' hotspot will 'snap' to a point snap guide when it passes into close proximity with it.
• – click to delete the currently selected guide.

• Units – use to select the default measurement units for the current PCB Library document. Default units are used to display any distance-related information on screen or in reports. The default units are always used if a unit's suffix (mm or mil) is not entered when specifying any distance-related information.
• Route Tool Path – use the drop-down to choose the mechanical layer (from all those currently enabled for use in the design) on which to define the route tool path for the board.

• Name – use this field to specify the footprint's name.
• Description – use this field to add a meaningful description for the footprint.
• Type – use this field to determine the type of footprint. Choose from the following types:
  • Standard – standard electrical footprint loaded onto the board; always synchronized, always in the BOM.
  • Mechanical – non-electrical footprint, e.g., heat sink or mounting bracket. Synchronized if it exists on both schematic and PCB documents and always included in the BOM.
  • Graphical – non-electrical footprint used for a company logo, title block, etc; never synchronized and not included in the BOM.
  • Net Tie (In BOM) – for shorting two (or more) nets together in the routing. Typically used if a jumper type footprint needs to be fitted and also provide shorting in the same location; always synchronized and included in the BOM.
  • Net Tie – as above but designed so you could not tell a footprint existed at the location where the shorting is to occur; always synchronized but not included in the BOM. When placing components of this type, use the Verify Shorting Copper option in the Design Rule Checker dialog (when performing a DRC in the PCB) to verify the short (i.e. that no unconnected copper exists in the footprint).
  • Standard (No BOM) – standard electrical footprint loaded onto board; always synchronized, not included in the BOM.
  • Jumper – used to represent a wire link, typically used on a single-sided board. On the schematic, Jumper-type footprints do not need to be wired in. They are only included to ensure that the Jumpers get included in the BOM. On the PCB, set the jumper pads to share the same non-zero JumperID value; the software recognizes this state, adds a symbolic link between the jumper pads to represent the wire link, and factors the link into design rule checks.
  The Type setting allows you to set the type for a footprint that is placed directly from the PCB Library onto the PCB design document. However, if the footprint has been placed on the schematic side and brought across to the PCB through the synchronization process, then the Type setting defined for that footprint – on the schematic side – will always take precedence.
• Height – use this field to specify a height for the footprint. This value is used by the Height design rule (part of the Placement category of rules). Refer to the Adding Height to a PCB Footprint section to learn more.
• Area – use this field to modify the area calculation of the component associated with the footprint.

The following options and controls are available only when defining a footprint from a Workspace:

• Item Revision – the Item-Revision ID used for the footprint model being defined in the Workspace.
• Source – provides the name of the Workspace in which the footprint model resides. Click to open the Explorer panel showing the footprint.
• Revision Details – displays any defined description of the footprint revision.

• Revision State – displays the current lifecycle state of the footprint revision.

Using this region of the panel, you can define the set of footprint parameters. Refer to the User-defined Footprint Parameters section to learn more.

BGA

BGA Package Dimensions

Use the BGA Package Dimensions page to enter the required package values for Overall Dimensions and Ball Information.

BGA Package Layout Options

Use the BGA Package Layout Options page to define the basic ball layout by adding or removing balls and changing the grid type.

Select the grid type from the drop-down. Selections include Plain Grid or Staggered Grid. 

Select the matrix type from the drop-down. Selections include Full Matrix, Perimeter, Thermally Enhanced, and Selectively Depopulated.

• If Full Matrix is selected, none of the other options of the region are available.
• If Perimeter is selected, only Cavity Size is accessible for updating.
• If Thermally Enhanced is selected, only Cavity Size and Size of Thermal Array are accessible for updating.
• If Selectively Depopulated is selected, all areas, including Add Balls to Cavity Border are accessible for updating.

BGA Pads Diameter

The BGA Pads Diameter page is used to specify the pad diameter of the footprint. The pad diameter is determined using the following methods:

• Select Use Maximum Material Condition (MMC) to use the largest pad size (IPC recommended) for the given ball diameter.
• Select Use Least Material Condition (LMC) to use the smallest pad size (IPC recommended) for the given ball diameter.
• Select Reduce from nominal ball diameter (B) in percent by to define a percentage reduction of the ball diameter then enter the desired percentage value in the textbox.

The pad diameter will be  - this statement is dynamically updated to show the current value based on the above selections.

BGA Silkscreen Dimensions

The BGA Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. 

Enable the Use calculated silkscreen dimensions to use the displayed values or disable the checkbox and enter the desired new values in the textboxes.

BGA Courtyard, Assembly and Component Body Information

The BGA Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable the Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

BQFP

BQFP Package Overall Dimensions

Use the BQFP Package Overall Dimensions page to set the package values. 

Enter the Lead Span Range (Minimum and Maximum), Maximum Height, and Minimum Standoff Height using the textboxes to the right of each option. Use the diagram to the right as a guide for each measurement.

Set the Pin 1 Location by selecting either Corner of Left Side or Center of Top Side. The Preview region is dynamically updated to show the Pin location.

BQFP Package Pin Dimensions

Enter the required values for the package pin dimensions on the BQFP Package Pin Dimensions page. 

Enter the Lead Width Range, Lead Length Range, Pitch, Body Length Range, and Number of pins.

BQFP Package Heel Spacing

Set the desired heel spacing values on the BQFP Package Heel Spacing page. The minimum heel spacing is calculated by subtracting twice the Maximum Lead Length Range from the Minimum Body Width that were set on the previous page. The maximum heel spacing is calculated by adding the tolerance on the inner distance between the heels of the opposing rows of leads to the minimum heel spacing.

Enable the Use calculated values checkbox to use the values currently displayed or enter values directly in the textboxes for S Minimum and S Maximum.

BQFP Solder Fillets

Set the required solder fillet values on the BQFP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

BQFP Component Tolerances

Enter the required values for component tolerances on the BQFP Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges based upon experience. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and/or Tolerance on the width of the component leads. 

BQFP IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the BQFP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

BQFP Footprint Dimensions

The BQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions (X and Y), and Pad Spacing. Select the correct Pad Shape, either Rounded or Rectangular.

BQFP Silkscreen Dimensions

The BQFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. 

BQFP Courtyard, Assembly and Component Body Information

The BQFP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable the Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for Courtyard, Assembly, and Component Body by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information.

CAPAE

CAPAE Component Package Dimensions

Enter the required values for the package dimensions on the CAPAE Component Package Dimensions page. 

Enter the Lead Span Range, Body Length Range, Body Width Range, Lead Length Range, Lead Width Range, Diameter Range, and Maximum Height.

CAPAE Component Package Heel Spacing

Set the desired heel spacing values on the CAPAE Component Package Heel Spacing page. The maximum heel spacing is calculated by adding the tolerance on the inner distance between the heels of the opposing rows of leads to the minimum heel spacing.

Enable the Use calculated values checkbox to use the values currently displayed or enter values directly in the textboxes for S Minimum and S Maximum.

CAPAE Component Solder Fillets

Set the required solder fillet values on the CAPAE Component Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

CAPAE Component Component Tolerances

Enter the required values for component tolerances on the CAPAE Component Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges based upon experience. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and/or Tolerance on the width of the component leads. 

CAPAE Component IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the CAPAE Component IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

CAPAE Component Footprint Dimensions

The CAPAE Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions (X and Y), and Pad Spacing. 

CAPAE Component Silkscreen Dimensions

The CAPAE Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter new desired values.

CAPAE Component Courtyard, Assembly and Component Body Information

The CAPAE Component Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

CFP

CFP Package Overall Dimensions

Use the CFP Package Overall Dimensions page to set the package values. 

Enter the Maximum Body Width, Maximum Body Length, Maximum Height, Minimum Standoff Height, and Absent Pins using the textboxes to the right of each option. Use the diagram to the right as a guide for each measurement.

CFP Package Pin Dimensions

Enter the required values for the package pin dimensions on the CFP Package Pin Dimensions page. 

Enter the Lead Width Range, Pitch, and Number of pins. Enable Use calculated values to accept the displayed values or disable the checkbox and enter new values for Lead Span Range and Lead Length Range.

CFP Package Heel Spacing

Set the desired heel spacing values on the CFP Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter values directly in the textboxes for S Minimum and S Maximum.

CFP Solder Fillets

Set the required solder fillet values on the CFP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

CFP Component Tolerances

Enter the required values for component tolerances on the CFP Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

CFP IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the CFP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

CFP Footprint Dimensions

The CFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions (X and Y), Pad Spacing. Select either Rounded or Rectangular for the Pad Shape. 

CFP Silkscreen Dimensions

The CFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

CFP Courtyard, Assembly and Component Body Information

The CFP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

Chip Array

Chip Array Package Dimensions

Use the ChipArray Package Dimensions page to set the package values. 

Enter the Body Span Range(s) and Maximum Height. Use the drop-down to select the Hull side type: Flat, Concave, ConvexE, or ConvexS.

Chip Array Package Pin Dimensions

Enter the required values for the package pin dimensions on the ChipArray Package Pin Dimensions page. 

Enter the Lead Width Range, Lead Length Range, Pitch, and Number of pins. 

Chip Array Package Heel Spacing

Set the desired heel spacing values on the ChipArray Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the value currently displayed or enter a new value directly in the textboxes for Smax.

Chip Array Solder Fillets

Set the required solder fillet values on the ChipArray Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Chip Array IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the ChipArray IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Chip Array Footprint Dimensions

The ChipArray Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions (X and Y), Pad Spacing. Select either Rounded or Rectangular for the Pad Shape. 

Chip Array Courtyard, Assembly and Component Body Information

The ChipArray Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

Chip Array Silkscreen Dimensions

The ChipArray Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

DFN

DFN Package Overall Dimensions

Use the DFN Package Overall Dimensions page to set the package values. 

Enter the Body Width Range, Body Length Range, Maximum Height, and Minimum Standoff Height. Use the drop-down to select the Package Type: DFN 2-Lead, DFN 3-Lead, or DFN 4-Lead.  

DFN Package Pin Dimensions

Enter the required values for the package pin dimensions on the DFN Package Pin Dimensions page. 

Enter the Lead Width Range(s), Lead Length Range(s), and Pitch(es).

DFN Solder Fillets Dimensions

Set the required solder fillet values on the DFN Solder Fillets Dimensions page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use Default value to use the values displayed or you can adjust it to suit your specific needs.

Use the Board Density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. Enter the Periphery value in the textbox.

DFN Tolerance Dimensions

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the DFN Tolerance Dimensions page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

DFN Footprint Dimensions

The DFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

DFN Silkscreen Dimensions

The DFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

DFN Mechanical Dimensions

The DFN Mechanical Dimensions page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

CHIP

Chip Component Package Dimensions

Enter the required values for the package dimensions on the Chip Component Package Dimensions page. 

Enter the Body Length Range, Body Width Range, Bandwidth Range, and Maximum Height. Use the drop-down to select the package type: Chip Capacitor, Chip Inductor, Chip Resistor, or Chip Diode.

Select the Polarity Pin Location. Choices include: None, Pin 1, and Pin 2.

Chip Component Package Heel Spacing

Set the desired heel spacing values on the Chip Component Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

Chip Component Solder Fillets 

Set the required solder fillet values on the Chip Component Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Chip Component Component Tolerances

Enter the required values for component tolerances on the Chip Component Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

Chip Component IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the Chip Component IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Chip Component Footprint Dimensions

The Chip Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Chip Component Silkscreen Dimensions

The Chip Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

Chip Component Courtyard, Assembly and Component Body Information

The Chip Component Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

CQFP

CQFP Package Overall Dimensions

Use the CQFP Package Overall Dimensions page to set the package values. 

Enter the Body Range, Maximum Height, and Minimum Standoff Height.

Select either Corner of Left Side or Center of Top Side for the Pin 1 Location. 

CQFP Package Pin Dimensions

Enter the required values for the package pin dimensions on the CQFP Package Pin Dimensions page. 

Enter the Lead Width Range(s), Pitch, and Number of pins.

Enable Use calculated values to use the values displayed or disable the option and enter the desired values for Lead Span Range(s) and Lead Length Range(s).

CQFP Package Heel Spacing

Set the desired heel spacing values on the CQFP Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

CQFP Solder Fillets 

Set the required solder fillet values on the CQFP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

CQFP Component Tolerances 

Enter the required values for component tolerances on the CQFP Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

CQFP IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the CQFP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

CQFP Footprint Dimensions

The CQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

CQFP Silkscreen Dimensions

The CQFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

CQFP Courtyard, Assembly and Component Body Information

The CQFP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

DPAK

DPAK Package Overall Dimensions

Use the DPAK Package Overall Dimensions page to set the package values. 

Enter the Length Range, Maximum Height, Minimum Standoff Height, Maximum Body Width, Maximum Body Length, and Number of pins (including tab). 

Use the drop-down to select the Tab Designator. 

Enable the Pin is trimmed checkbox to denote trimmed pins for each pad designator in the table.

DPAK Package Pin Dimensions

Enter the required values for the package pin dimensions on the DPAK Package Pin Dimensions page. 

Enter the Lead Width Range(s), Lead Length Range(s), Tab Width Range(s), Tab Length Range(s), Tab Overhang, and Pitch(es).

DPAK Package Heel Spacing

Set the desired heel spacing values on the DPAK Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

DPAK Solder Fillets 

Set the required solder fillet values on the DPAK Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet(s), and Side Fillet(s), the Use default values option must be disabled. Enter the new values directly in the textboxes.

DPAK Component Tolerances 

Enter the required values for component tolerances on the DPAK Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

DPAK IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the DPAK IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

DPAK Footprint Dimensions

The DPAK Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

DPAK Silkscreen Dimensions

The DPAK Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

DPAK Courtyard, Assembly and Component Body Information

The DPAK Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

LCC

Leadless Chip Carrier Package Dimensions

Use the Leadless Chip Carrier Package Dimensions page to enter the required package values for Body Width Range, Body Length Range, Maximum Height, and Minimum Package Height. Set the Pin 1 Location by selecting either Side of D or Center of E.

Leadless Chip Carrier Package Pin Dimensions

Enter the required values for the package pin dimensions on the Leadless Chip Carrier Package Pin Dimensions page. 

Leadless Chip Carrier Package Toe Spacing

Use the Leadless Chip Carrier Package Toe Spacing page to enter the required toe spacing values. Enable Use calculated values to accept the displayed values or disable the checkbox and enter the desired values.

Leadless Chip Carrier Solder Fillets

Set the required solder fillet values on the Leadless Chip Carrier Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Heel Fillet (JH Min), Toe Fillet (JT Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Leadless Chip Carrier Component Tolerances 

Enter the required values for component tolerances on the Leadless Chip Carrier Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

Leadless Chip Carrier IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the Leadless Chip Carrier IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Leadless Chip Carrier Footprint Dimensions

The Leadless Chip Carrier Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

Leadless Chip Carrier Silkscreen Dimensions

The Leadless Chip Carrier Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

Leadless Chip Carrier Courtyard, Assembly and Component Body Information

The Leadless Chip Carrier Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

LGA

LGA Package Dimensions

Use the LGA Package Dimensions page to enter the required package values for Overall Dimensions and Lead Information.

LGA Package Layout Options

Use the LGA Package Layout Options page to define the basic ball layout by adding or removing balls and changing the grid type.

Select the grid type from the drop-down. Selections include Plain Grid or Staggered Grid. 

Select the matrix type from the drop-down. Selections include Full Matrix, Perimeter, Thermally Enhanced, and Selectively Depopulated.

• If Full Matrix is selected, none of the other options of the region are available.
• If Perimeter is selected, only Cavity Size is accessible for updating.
• If Thermally Enhanced is selected, only Cavity Size and Size of Thermal Array are accessible for updating.
• If Selectively Depopulated is selected, all areas, including Add Balls to Cavity Border, are accessible for updating.

LGA Pads Diameter

The LGA Pads Diameter page is used to specify the pad diameter of the footprint. Enable Use default values to accept the displayed Periphery value or disable and enter new values. 

Select either Rounded or Rectangular for Pad Shape. 

LGA Silkscreen Dimensions

The LGA Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

LGA Courtyard, Assembly and Component Body Information

The LGA Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

MELF

MELF Component Package Dimensions

Use the MELF Component Package Dimensions page to enter the required package values for Body Length Range, Body Width Range, and Bandwidth Range. Use the drop-down to select the Package Type: MELF Diode or MELF Resistor. Set the Cathode Location by selecting either Pin 1 or Pin 2.

MELF Component Package Heel Spacing

Set the desired heel spacing values on the MELF Component Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

MELF Component Solder Fillets 

Set the required solder fillet values on the MELF Component Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

MELF Component Component Tolerances

Enter the required values for component tolerances on the MELF Component Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

MELF Component IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the MELF Component IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

MELF Component Footprint Dimensions

The MELF Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

MELF Component Silkscreen Dimensions

The MELF Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

MELF Component Courtyard, Assembly and Component Body Information

The MELF Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

MOLDED

Molded Component Package Dimensions

Use the Molded Component Package Dimensions page to enter the required package values for Body Length Range, Body Width Range, Lead Length Range, Lead Width Range, and Maximum Height. Use the drop-down to select the Package Type: Molded Capacitor, Molded Inductor, or Molded Diode. Set the Polarity Pin Location by selecting None, Pin 1 or Pin 2.

Molded Component Package Toe Spacing

Set the desired heel spacing values on the Molded Component Package Toe Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

Molded Component Solder Fillets 

Set the required solder fillet values on the Molded Component Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Molded Component Component Tolerances

Enter the required values for component tolerances on the Molded Component Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

Molded Component IPC Tolerances

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the Molded Component IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Molded Component Footprint Dimensions

The Molded Component Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Molded Component Silkscreen Dimensions

The Molded Component Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

Molded Component Courtyard, Assembly and Component Body Information

The Molded Component Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

PLCC

PLCC Square Package Overall Dimensions

Use the PLCC Square Package Overall Dimensions page to enter the required package values for Body Length Range(s), Maximum Height, and Minimum Standoff Height. Set the Pin 1 Location by selecting either Corner of Left Side or Center of Top Side.

PLCC Square Package Pin Dimensions

Enter the required values for the package pin dimensions on the PLCC Square Package Pin Dimensions page. 

PLCC Square Package Toe Spacing

Set the desired heel spacing values on the PLCC Square Package Toe Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

PLCC Square Solder Fillets 

Set the required solder fillet values on the PLCC Square Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

PLCC Square Component Tolerances

Enter the required values for component tolerances on the PLCC Square Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

PLCC Square IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the PLCC Square IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

PLCC Square Footprint Dimensions

The PLCC Square Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

PLCC Square Silkscreen Dimensions

The PLCC Square Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

PLCC Square Courtyard, Assembly and Component Body Information

The PLCC Square Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

PQFN

PQFN Package Overall Dimensions

Use the PQFN Package Overall Dimensions page to enter the required package values for Body Span Range(s), Maximum Height, Minimum Standoff Height, and Chamfered corner. Set the Pin 1 Location by selecting either Side of D or Center of E.

PQFN Package Pin Dimensions

Enter the required values for the package pin dimensions on the PQFN Package Pin Dimensions page. 

PQFN Package Power Pad Dimensions

Enter the required values for the power pad dimensions on the PQFN Package Power Pad Dimensions page. Enable Add Power and Ground Bars to access Width, Power Bar Lengths, Ground Bar Lengths, Power Bar Spacings, and Ground Bar Spacings. Enter any required changes in the textboxes. 

PQFN Package Heel Spacing

Set the desired heel spacing values on the PQFN Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for SE Minimum, SE Maximum, SD Minimum, and SD Maximum.

PQFN Solder Fillets 

Set the required solder fillet values on the PQFN Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

Enter the desired value for Periphery.

PQFN Component Tolerances 

Enter the required values for component tolerances on the PQFN Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

PQFN IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the PQFN IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

PQFN Footprint Dimensions

The PQFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

PQFN Silkscreen Dimensions

The PQFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

PQFN Courtyard, Assembly and Component Body Information

The PQFN Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

PQFP

PQFP Package Overall Dimensions

Use the PQFP Package Overall Dimensions page to enter the required package values for Lead Span Range(s), Maximum Height, and Minimum Standoff Height. Set the Pin 1 Location by selecting either Side of D or Center of E.

PQFP Package Pin Dimensions

Enter the required values for the package pin dimensions on the PQFP Package Pin Dimensions page. 

PQFP Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the PQFP Package Thermal Pad Dimensions page. Enable Add Thermal Pad to access the Thermal Pad Range options and enter any required changes in the textboxes. 

PQFP Package Heel Spacing

Set the desired heel spacing values on the PQFP Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for SE Minimum, SE Maximum, SD Minimum, and SD Maximum.

PQFP Solder Fillets 

Set the required solder fillet values on the PQFP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

PQFP Component Tolerances 

Enter the required values for component tolerances on the PQFP Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

PQFP IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the PQFP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

PQFP Footprint Dimensions

The PQFP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

PQFP Silkscreen Dimensions

The PQFP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

PQFP Courtyard, Assembly and Component Body Information

The PQFP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

PSON

PSON Package Dimensions

Use the PSON Package Dimensions page to enter the required package values for Body Span Range(s), Maximum Height, Minimum Standoff Height, and Pin Count. 

PSON Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the PSON Package Thermal Pad Dimensions page. Enter any required changes in the textboxes. 

PSON Solder Fillets 

Set the required solder fillet values on the PSON Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

Enter the value for Periphery in the textbox.

PSON Component Tolerances

Enter the required values for component tolerances on the PSON Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

PSON IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the PSON IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

PSON Footprint Dimensions

The PSON Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or disable and enter new values for Pad Dimensions and Pad Spacing. 

PSON Footprint Paste Fill Dimensions

The PSON Footprint Paste Fill Dimensions page displays the inferred footprint paste fill dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or disable and enter new values for Paste Fill Dimensions. 

PSON Silkscreen Dimensions

The PSON Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

PSON Courtyard, Assembly and Component Body Information

The PSON Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

QFN

QFN Package Overall Dimensions

Use the QFN Package Overall Dimensions page to enter the required package values for Body Span Range(s), Maximum Height, Minimum Standoff Height, and Chamfered corner. Set the Pin 1 Location by selecting either Side of D or Center of E.

QFN Package Pin Dimensions

Enter the required values for the package pin dimensions on the QFN Package Pin Dimensions page. 

QFN Package Power Pad Dimensions

Enter the required values for the power pad dimensions on the QFN Package Power Pad Dimensions page. Enable Add Power and Ground Bars to access Width, Power Bar Lengths, Ground Bar Lengths, Power Bar Spacings, and Ground Bar Spacings. Enter any required changes in the textboxes. 

QFN Package Heel Spacing

Set the desired heel spacing values on the QFN Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for SE Minimum, SE Maximum, SD Minimum, and SD Maximum.

QFN Solder Fillets 

Set the required solder fillet values on the QFN Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

QFN Component Tolerances 

Enter the required values for component tolerances on the QFN Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

QFN IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the QFN IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

QFN Footprint Dimensions

The QFN Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

QFN Silkscreen Dimensions

The QFN Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

QFN Courtyard, Assembly and Component Body Information

The QFN Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

QFN-2ROW

QFN-2ROW Package Overall Dimensions

Use the QFN-2ROW Package Overall Dimensions page to enter the required package values for Body Span Range(s), Maximum Height, Minimum Standoff Height, and Total number of pins. Enable Calculate number of pins in rows to use the displayed values or disable and enter new Number of pins values.

QFN-2ROW Package Pin Dimensions

Enter the required values for the package pin dimensions on the QFN-2ROW Package Pin Dimensions page. 

Enter the Lead Width Range, Lead Length Range, Pitch, and Row Pitch.

Enable Add Thermal Pad to add a thermal pad then enter the Thermal Pad Range values.

QFN-2ROW Package Heel Spacing

Set the desired heel spacing values on the QFN-2ROW Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S1 Minimum and S1 Maximum.

QFN-2ROW Solder Fillets 

Set the required solder fillet values on the QFN-2ROW Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

QFN-2ROW Component Tolerances 

Enter the required values for component tolerances on the QFN-2ROW Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

QFN-2ROW IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the QFN-2ROW IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

QFN-2ROW Footprint Dimensions

The QFN-2ROW Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

QFN-2ROW Courtyard, Assembly and Component Body Information

The QFN-2ROW Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SODFL

SODFL Package Dimensions

Use the SODFL Package Dimensions page to enter the required package values for Body Width Range, Body Length Range, Maximum Height, Lead Width Range, Lead Length Range, and Lead Span Range. 

SODFL Package Heel Spacing

Set the desired heel spacing values on the SODFL Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

SODFL Solder Fillets

Set the required solder fillet values on the SODFL Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SODFL Component Tolerances 

Enter the required values for component tolerances on the SODFL Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SODFL IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SODFL IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SODFL Footprint Dimensions

The SODFL Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

SODFL Silkscreen Dimensions

The SODFL Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SODFL Courtyard, Assembly and Component Body Information

The SODFL Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SOIC

SOIC Package Dimensions

Use the SOIC Package Dimensions page to enter the required package values for Overall Dimensions and Pin Information.

SOIC Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the SOIC Package Thermal Pad Dimensions page. Enable Add Thermal Pad if required and enter any changes for Thermal Pad Range(s). 

SOIC Package Heel Spacing

Set the desired heel spacing values on the SOIC Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

SOIC Solder Fillets 

Set the required solder fillet values on the SOIC Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOIC Component Tolerances

Enter the required values for component tolerances on the SOIC Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SOIC IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOIC IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SOIC Footprint Dimensions

The SOIC Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

SOIC Silkscreen Dimensions

The SOIC Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOIC Courtyard, Assembly and Component Body Information

The SOIC Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SOJ

SOJ Package Dimensions

Use the SOJ Package Dimensions page to enter the required package values for Overall Dimensions and Pin Information.

SOJ Package Heel Spacing

Set the desired heel spacing values on the SOJ Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

SOJ Solder Fillets 

Set the required solder fillet values on the SOJ Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOJ Component Tolerances 

Enter the required values for component tolerances on the SOJ Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SOJ IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOJ IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SOJ Footprint Dimensions

The SOJ Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

SOJ Silkscreen Dimensions

The SOJ Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOJ Courtyard, Assembly and Component Body Information

The SOJ Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SON

SON Package Dimensions

Use the SON Package Dimensions page to enter the required package values for Body Span Range(s), Maximum Height, Minimum Standoff Height, and Pin Count. 

SON Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the SON Package Thermal Pad Dimensions page. Enter any required changes for Lead Width Range, Lead Length Range, Pitch, Thermal Pad Ranges (s), and Lead Height.

SON Package Heel Spacing

Set the desired heel spacing values on the SON Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for Minimum and Maximum.

SON Solder Fillets 

Set the required solder fillet values on the SON Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SON Component Tolerances 

Enter the required values for component tolerances on the SON Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SON IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SON IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SON Footprint Dimensions

The SON Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

SON Footprint Paste Fill Dimensions

The SON Footprint Paste Fill Dimensions page displays the inferred footprint paste fill dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or disable and enter new values for Paste Fill Dimensions. 

SON Silkscreen Dimensions

The SON Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SON Courtyard, Assembly and Component Body Information

The SON Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SOP/TSOP

SOP/TSOP Package Dimensions

Use the SOP/TSOP Package Dimensions page to enter values for Overall Dimensions and Pin Information. 

SOP/TSOP Package Thermal Pad Dimensions

Enter the required values for the thermal pad dimensions on the SOP/TSOP Package Thermal Pad Dimensions page. Enable Add Thermal Pad if required then enter any desired changes in Thermal Pad Range(s).

SOP/TSOP Package Heel Spacing

Set the desired heel spacing values on the SOP/TSOP Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

SOP/TSOP Solder Fillets 

Set the required solder fillet values on the SOP/TSOP Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOP/TSOP Component Tolerances 

Enter the required values for component tolerances on the SOP/TSOP Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SOP/TSOP IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOP/TSOP IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SOP/TSOP Footprint Dimensions

The SOP/TSOP Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Select either Rounded or Rectangular for Pad Shape.

SOP/TSOP Silkscreen Dimensions

The SOP/TSOP Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOP/TSOP Courtyard, Assembly and Component Body Information

The SOP/TSOP Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SOT143/343

SOT143/343 Package Overall Dimensions

Use the SOT143/343 Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, Maximum Height, and Minimum Standoff Height. Use the drop down to select the correct Package Type: SOT143 or SOT343.

To specify the Pin Order, use  and  to move the selected Pad Designator up or down in the list. 

Large Pin Options can be specified by selecting Single large pin or Top left and top right pins are large. If Single large pin is selected, use the drop down to specify the location: Top left, Bottom left, Bottom right, or Top right. The Preview region is dynamically updated. 

SOT143/343 Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOT143/343 Package Pin Dimensions page. 

SOT143/343 Package Heel Spacing

Set the desired heel spacing values on the SOT143/343 Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

SOT143/343 Solder Fillets 

Set the required solder fillet values on the SOT143/343 Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOT143/343 Component Tolerances 

Enter the required values for component tolerances on the SOT143/343 Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SOT143/343 IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOT143/343 IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SOT143/343 Footprint Dimensions

The SOT143/343 Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

SOT143/343 Silkscreen Dimensions

The SOT143/343 Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOT143/343 Courtyard, Assembly and Component Body Information

The SOT143/343 Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SOT223

SOT223 Package Overall Dimensions

Use the SOT223 Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, Maximum Height, and Minimum Standoff Height. 

SOT223 Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOT223 Package Pin Dimensions page. 

SOT223 Package Heel Spacing

Set the desired heel spacing values on the SOT223 Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

SOT223 Solder Fillets 

Set the required solder fillet values on the SOT223 Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOT223 Component Tolerances 

Enter the required values for component tolerances on the SOT223 Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SOT223 IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOT223 IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SOT223 Footprint Dimensions

The SOT223 Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

SOT223 Silkscreen Dimensions

The SOT223 Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOT223 Courtyard, Assembly and Component Body Information

The SOT223 Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SOT23

SOT23 Package Overall Dimensions

Use the SOT23 Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, Maximum Height, and Minimum Standoff Height. Use the drop down to select the correct Package Type: SOT23 3-Lead, SOT23 5-Lead, or SOT23 6-Lead.

To specify the Pin Order, use  and  to move the selected Pad Designator up or down in the list. 

SOT23 Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOT23 Package Pin Dimensions page. 

SOT23 Package Heel Spacing

Set the desired heel spacing values on the SOT23 Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

SOT23 Package Round Off

Use the SOT23 Package Round Off page to set the round off value. Enable Use Calculated Value to use the value currently displayed or enter a new value directly in the textbox for Round Off Pitch.

SOT23 Solder Fillets 

Set the required solder fillet values on the SOT23 Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOT23 Component Tolerances 

Enter the required values for component tolerances on the SOT23 Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SOT23 IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOT23 IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SOT23 Footprint Dimensions

The SOT23 Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

SOT23 Silkscreen Dimensions

The SOT23 Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOT23 Courtyard, Assembly and Component Body Information

The SOT23 Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SOT89

SOT89 Package Overall Dimensions

Use the SOT89 Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, and Maximum Height.

Enable Reverse Pin Order to reverse the pin order. The Preview region is dynamically updated.

SOT89 Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOT89 Package Pin Dimensions page. 

SOT89 Solder Fillets 

Set the required solder fillet values on the SOT89 Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOT89 Component Tolerances 

Enter the required values for component tolerances on the SOT89 Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SOT89 IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOT89 IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SOT89 Footprint Dimensions

The SOT89 Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

SOT89 Silkscreen Dimensions

The SOT89 Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOT89 Courtyard, Assembly and Component Body Information

The SOT89 Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

SOTFL

SOTFL Package Overall Dimensions

Use the SOTFL Package Overall Dimensions page to set the required values for Body Width Range, Body Length Range, and Maximum Height. Use the drop down to select the correct Package Type: SOTFL 3-Lead, SOTFL 5-Lead, or SOTFL 6-Lead.

To specify the Pin Order, use  and  to move the selected Pad Designator up or down in the list. 

SOTFL Package Pin Dimensions

Enter the required values for the package pin dimensions on the SOTFL Package Pin Dimensions page. 

SOTFL Package Heel Spacing

Set the desired heel spacing values on the SOTFL Package Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

SOTFL Solder Fillets 

Set the required solder fillet values on the SOTFL Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

SOTFL Component Tolerances 

Enter the required values for component tolerances on the SOTFL Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

SOTFL IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the SOTFL IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

SOTFL Footprint Dimensions

The SOTFL Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

SOTFL Silkscreen Dimensions

The SOTFL Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

SOTFL Courtyard, Assembly and Component Body Information

The SOTFL Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

WIRE WOUND

Precision Wire Wound Package Dimensions

Use the Precision Wire Wound Package Dimensions page to set the required values for Body Length Range, Body Width Range, Lead Length Range, Lead Width Range, and Maximum Height. 

Set the Polarity Pin Location by selecting either None, Pin 1, or Pin 2.

Precision Wire Wound Heel Spacing

Set the desired heel spacing values on the Precision Wire Wound Heel Spacing page. 

Enable the Use calculated values checkbox to use the values currently displayed or enter new values directly in the textboxes for S Minimum and S Maximum.

Precision Wire Wound Solder Fillets 

Set the required solder fillet values on the Precision Wire Wound Solder Fillets page. Solder fillet refers to the shape of the solder joint between the component lead and the PCB pad. Adequate fillet is required to ensure both the strength and reliability of the solder joints. A solder joint may be described by three fillets: toe, heel, and side.

Minimum values for solder fillets at the toe, heel and side of the component lead have been determined by IPC based on industry empirical knowledge and reliability testing. Enable Use default values to use the values displayed or you can adjust them to suit your specific needs.

Use the Board density Level drop-down to select the desired board density. Choose from Level A - Low density, Level B - Medium density, and Level C - High density. The Preview region is dynamically updated to show your changes.

To update the values for Toe Fillet (JT Min), Heel Fillet (JH Min), and Side Fillet (JS Min), the Use default values option must be disabled. Enter the new values directly in the textboxes.

Precision Wire Wound Component Tolerances 

Enter the required values for component tolerances on the Precision Wire Wound Component Tolerances page. 

Component manufacturers usually specify the minimum and maximum value for each package dimension. Component tolerance ranges are derived by subtracting the minimum value from the maximum value. You can adjust three of these ranges. 

If the displayed values are correct for your current situation, enable the Use calculated component tolerances textbox. If the tolerance values need to be adjusted, ensure Use calculated component tolerances is disabled then enter the new values directly in the textboxes next to Tolerance on the overall width of the component, including leads, Tolerance on the inner distance between the heels of the opposing rows of leads, and Tolerance on the width of the component leads. 

Precision Wire Wound IPC Tolerances 

IPC specifies certain tolerances for a number of standardized surface-mount package types. These tolerances are assumed by the Wizard in order to calculate a corresponding PCB footprint. You can modify the tolerances related to fabrication and placement on the Precision Wire Wound IPC Tolerances page. Enable Use Default Values to accept the displayed values. You can change the values for Fabrication Tolerance Assumption, Placement Tolerance Assumption, and Courtyard Excess by entering the new values directly in the textboxes.

Precision Wire Wound Footprint Dimensions

The Precision Wire Wound Footprint Dimensions page displays the inferred footprint dimensions using the package dimensions previously defined. To use the displayed values, enable Use calculated footprint values or enter new values for Pad Dimensions and Pad Spacing. 

Precision Wire Wound Silkscreen Dimensions

The Precision Wire Wound Silkscreen Dimensions page displays the inferred silkscreen dimensions using the package dimensions previously defined. You can further define the silkscreen dimensions by entering a new value for the Silkscreen Line Width. Enable Use calculated silkscreen dimensions to use the values displayed or disable the option and enter the desired values.

Precision Wire Wound Courtyard, Assembly and Component Body Information

The Precision Wire Wound Courtyard, Assembly and Component Body Information page displays the inferred mechanical dimensions using the package dimensions previously defined.

Enable Add Courtyard Information and Add Assembly Information to add courtyard and assembly information to the component drawing. For each, you can use the IPC calculated dimensions or enter new values directly in the textboxes. If desired, enter a new Line Width directly in the textbox. You can also select the mechanical layer for courtyard and assembly by using the drop-down next to Layer and selecting the desired mechanical layer. 

A component body contains the volumetric information corresponding to the package dimensions. Enable Add Component Body Information to include this information. Enable Use calculated values to use the values displayed or disable the option and enter new desired values. You can also select the mechanical layer for the component body by using the drop-down next to Layer and selecting the desired mechanical layer. 

Ball Grid Arrays (BGA)

To change the pads' diameters, click on the value and enter the new value.

To change the pad to pad distances, click on the values and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select either Alpha Numeric or Numeric naming style.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Capacitors

Use the drop-down to select the type of capacitor you want to design. Choose from Through Hole or Surface Mount.

To change the pads' dimensions, click on the values and enter the new values.

To change the pads positioning, click on the value and enter the new value.

Use the drop-down to select the capacitor's polarity, either Not Polarised or Polarised. Use the drop-down to select the capacitor's mounting style, either Axial or Radial.

Use the drop-down to select outline type, either Non polarised Outline or Polarised Outline. 

To change the outline dimensions, click on the values and enter the new values.

Diodes

Use the drop-down to select the type of diode you want to design. Choose from Through Hole or Surface Mount.

To change the pads' dimensions, click on the values and enter the new values.

To change the pads positioning, click on the value and enter the new value.

To change the outline dimensions, click on the value and enter the new value.

Dual In-line Packages (DIP)

To change the pads' dimensions, click on the value and enter the new required value.

To change the pads' layout, click on the value and enter the new required value.

To change the outline width, click on the value and enter the new required value.

Use the up and down arrows to select the total number of pads.

Edge Connectors

To change the pads' dimensions, click on the value and enter the new required value.

To change the pad to pad distance, click on the value and enter the new required value.

Use the up and down arrows to select the number of pads. Click the green arrow to change the naming order. The arrow will dynamically change to display the order.

Leadless Chip Carriers (LCC)

To change the pads' dimensions, click on the value and enter the new required value.

Use the drop-down to choose the pads' shapes. Select from Round or Rectangular for For the first pad, then select Round or Rectangular for For the other pads.

To change the outline width, click on the value and enter the new required value.

To change the pads' positioning, click on the value and enter the new required value.

Click one of the radio buttons to select the first pad's location. Choose the naming direction by clicking on the green arrow. The arrow will dynamically update to display the order.

Use the up and down arrows to select the number of pads for both X and Y.

Pin Grid Arrays (PGA)

To change the pads' dimensions, click on the value and enter the new required value.

To change the pad to pad distances, click on the value and enter the new required value.

To change the outline width, click on the value and enter the new required value.

Use the drop-down to select the pads naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Quad Packs (QUAD)

To change the pads' dimensions, click on the value and enter the new required value.

Use the drop-down to choose the pads' shapes. Select from Round or Rectangular for For the first pad, then select Round or Rectangular for For the other pads.

To change the outline width, click on the value and enter the new required value.

To change the pads' positioning, click on the value and enter the new required value.

Click one of the radio buttons to select the first pad's location. Choose the naming direction by clicking on the green arrow. The arrow will dynamically update to display the order.

Use the up and down arrows to select the number of pads for both X and Y.

Resistors

Defining the Board Technology

Select the type of resistor you want to design from the drop-down. Choices include Through Hole or Surface Mount.

Defining the Pads Dimensions

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline dimensions, click on the value and enter the new value.

Small Outline Packages (SOP)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the up and down arrows to select the total number of pads.

Staggered Ball Grid Arrays (SBGA)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select the pads naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.

Staggered Pin Grid Arrays (SPGA)

To change the pads' dimensions, click on the value and enter the new value.

To change the pad to pad distance, click on the value and enter the new value.

To change the outline width, click on the value and enter the new value.

Use the drop-down to select the pads' naming style, either Alpha Numeric or Numeric.

Use the up and down arrows in each region to define the footprint value for Cutout, Center, Rows and columns, and Corner.