Optimize Connections and PCB Design with Wire Bonding

Ensure accurate bonding and efficient design processes
with Altium's integrated wire bonding.

Support for Chip-Up Wire Bonding Configurations

Altium Designer's wire bonding capabilities support chip-up configurations for Chip on Board (CoB) designs. Our tools offer the flexibility to accommodate these specific designs, ensuring precise execution and meeting design challenges with confidence.

Easy Validation of Bond Wiring in 3D View

Easily validate bond wiring with Altium Designer's 3D view. Visualize bond wiring, chip dies, and die pins alongside other parts of your project in a 3D View. Simplify the verification and adjustment of parameters, ensuring greater accuracy and fit, while reducing errors and improving overall design quality.

Ensure Design Integrity with Comprehensive Verification

Maintain high standards with comprehensive verification checks. Altium Designer ensures all bonding connections meet stringent design rules, preventing errors and ensuring manufacturability. Automated DRCs verify bond wire to bond wire spacing, wire length, and connection integrity, providing reliable design outcomes.

Electrical Layers for Die Pins
and Bond Wires

Utilize electrical layers outside the main layer stack specifically for die pins and bond wires. This configuration ensures clear and accurate representation of wire bonding elements, enhancing the reliability and precision of your designs.

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Introduction of Bond Wire
Primitive

Take advantage of the new Bond Wire primitive, supported in both 2D and 3D. This primitive allows for detailed and accurate wire bonding representations, ensuring that your designs are both visually clear and functionally precise.

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Wire Bonding at Library
and PCB Doc Levels

Perform wire bonding at both the library and PCB document levels. This capability offers flexibility and precision in your design process, surpassing competitors who only support wire bonding at the PCB level.

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Versatile Bonding
Options

Connect various objects using wire bonding, including Die to Bond Finger, Die-to-Die, Die to any Copper, and Copper to Copper. This versatility allows for comprehensive and flexible design configurations to meet diverse project needs.

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Support for Multiple Bond
Wire Tiers

Manage designs with multiple rows of bond wires, ensuring flexibility and scalability. Altium Designer supports various bonding configurations, allowing you to create effective CoB designs with ease. This feature helps in developing detailed and high-density wire bonding designs.

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Support in Assembly
and Documentation Outputs

Generate assembly and documentation outputs that include wire bonding details. This support ensures that all necessary bonding information is accurately communicated to manufacturers, facilitating seamless production and assembly processes.

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Multiple Wires for the Same
Die Pin or Bond Finger

Connect multiple wires to the same die pin or bond finger, increasing current carrying capacity while maintaining consistent bond wire thickness. This capability enables the creation of more complex topologies in your PCB designs, enhancing design flexibility and efficiency.

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Optional Bond Finger
Alignment by Wires

Align bond fingers to be parallel to bond wires, ensuring correct positioning for optimal performance. This alignment enhances the accuracy and reliability of wire bonding, improving overall design integrity and simplifying the design process.

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