KB: Deposit copper thieving pattern to achieve uniform plating distribution
Created: ноября 11, 2024 | Updated: ноября 15, 2024
Altium Designer
Starting in version: 18
Up to Current
Copper thieving may be requrired or desired on the outermost layers to achieve uniform plating distribution by a fabricator. Unfortunately, there is no straightforward command/feature in one go to achieve copper theving currently, but there is a workaround identified to leverage Via Stitching feature to realize a thieving pattern.
Solution Details
Unfortunately, there is no straightforward command/feature in one go to achieve copper theving currently. There is a workaround identified to leverage Via Stitching feature to realize a thieving pattern.
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Copy the poured polgon, which you want to thieve, to somewhere outside the board
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Place another copper fill over, so you have somthing to stitch against
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Apply via stitching to populate an array of vias within the polygon shape
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Tools » Convert » Convert Selected Vias to Free Pads to covert the via array to free pads.
For a visual aid, please refer videos here:
https://www.youtube.com/watch?v=Ca2rFu2zW_k
https://www.youtube.com/watch?v=6RsW8ehU_lI