Preparing Assembly Data in Altium Designer

A number of assembly file formats can be prepared and generated for your PCB design, including:

  • Assembly Drawings

  • Pick and Place Files

  • Assembly Testpoint Reports

  • Wire Bonding Table Reports

Assembly outputs can be added to the active Output Job file from the menu of the [Add New Assembly Output] control in the Assembly Outputs region of the file or from the Edit » Add Assembly Outputs sub-menus of the main menus.

While OutputJob files facilitate streamlined preparation of outputs for your designs and their subsequent generation using the high-integrity project release process, assembly outputs for the active PCB design can also be generated directly from the PCB editor using commands from the File » Assembly Outputs sub-menu.

Preparing Assembly Drawings

The Assembly Drawings output is a print-based output with predefined settings for pages and layers thereon. Access the Print dialog to examine and adjust the configuration of the output.

Refer to the Configuring PCB Printouts page to learn more.

Preparing Pick and Place Files

The Generates pick and place output generator produces a report that details the location, rotation, and side of the board for each component on the board. The report can be generated in either CSV or text format. All components that have a component type of Standard are included in the report. Components whose type is set to any other value, such as Graphical, are not included.

The required report is configured in the Pick and Place Setup dialog.

The Pick and Place Setup dialog
The Pick and Place Setup dialog

Preparing Assembly Testpoint Reports

The assembly testpoint report generator produces a report (in txt and/or csv and/or IPC-D-356A formats) of all pads and vias that are setup for use as assembly testpoints.

Refer to the Assigning Testpoints on the Board page to learn more about assigning testpoints in a PCB design.

The testpoint report supports embedded board arrays. Multiple IPC-D-356A netlist files are produced when exported from a PCB document that contains multiple embedded board arrays.

Assembly Testpoint Report output options are configured using the Assembly Testpoint Setup dialog.

The AssemblyTestpoint Setup dialog
The AssemblyTestpoint Setup dialog

An assembly testpoint report will only use pad and via Assembly testpoint settings, while a fabrication testpoint report will use only Fabrication testpoint settings. Note that the Assembly Testpoint Setup dialog used to configure an Assembly Fabrication Report has the same set of options as the Fabrication Report Setup dialog.
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Примечание

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