Altium Designer Documentation
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((Dialog Reference))_AD
Dialogs((A to F))_AD
PCB_Dlg-ReportFormBoard Report_AD
Created: Lipiec 28, 2015 | Updated: Czerwiec 16, 2017
| Applies to versions: 15.1, 16.0, 16.1, 17.0 and 17.1
Now reading version 16.0. For the latest, read: PCB_Dlg-ReportForm((Board Report))_AD for version 21
The Board Report dialog.
Summary
This dialog allows the designer to specify the content to be included when generating a detailed report for the board.
Access
The dialog is accessed from the PCB Editor, by clicking the Report button in the PCB Information dialog. The latter is accessed by using the Reports » Board Information command, from the main menus.
Options/Controls
- Items to include - this main region of the dialog lists all of the items that can be included in the report. To include information on a particular attribute of the board, simply ensure its associated check box is ticked. Supported items for inclusion are:
- Board Specifications - general information about the board size, and the number of components on the board.
- Layer Information - how many primitives (arcs, pads, vias, tracks, texts, fills, regions, component bodies) are on each used layer of the board, along with total usage for each primitive type.
- Layer Pair - the defined drill layer pairs, along with a breakdown of the number of vias starting and stopping between those pairs.
- Non-Plated Hole Size - the number of pads and vias for each hole size of this type.
- Plated Hole Size - the number of pads and vias for each hole size of this type.
- Non-Plated Slot Size - the number of pads for each slot size of this type.
- Plated Slot Size - the number of pads for each slot size of this type.
- Non-Plated Square Holes Size - the number of pads for each hole size of this type.
- Plated Square Holes Size - the number of pads for each hole size of this type.
- Top Layer Annular Ring Size - the number of objects (pads and vias) for each annular ring size on the top layer.
- Mid Layer Annular Ring Size - the number of objects (pads and vias) for each annular ring size on a mid layer.
- Bottom Layer Annular Ring Size - the number of objects (pads and vias) for each annular ring size on the bottom layer.
- Pad Solder Mask - the number of pads for each specified, and unique, solder mask expansion value.
- Pad Paste Mask - the number of pads for each specified, and unique, paste mask expansion value.
- Pad Pwr/Gnd Expansion - the number of pads associated with unique Clearance values specified in defined power plane clearance rules.
- Pad Relief Conductor Width - the number of pads associated with unique Conductor Width values specified in defined power plane connect style rules, whose Connect Style is set to Relief Connect.
- Pad Relief Air Gap - the number of pads associated with unique Air-Gap values specified in defined power plane connect style rules, whose Connect Style is set to Relief Connect.
- Pad Relief Entries - the number of pads associated with unique Conductors values specified in defined power plane connect style rules, whose Connect Style is set to Relief Connect.
- Via Solder Mask - the number of vias for each specified, and unique, solder mask expansion value.
- Via Pwr/Gnd Expansion - the number of pads associated with unique Clearance values specified in defined power plane clearance rules.
- Track Width - the number of objects for each unique track width used in the design.
- Arc Line Width - the number of objects for each unique arc line width used in the design.
- Arc Radius - the number of objects for each unique arc radius used in the design.
- Arc Degrees - the number of objects for each unique arc angle used in the design.
- Text Height - the number of objects for each unique text height used in the design.
- Text Width - the number of objects for each unique text width used in the design.
- Polygon Clearance - the number of polygons of each clearance used in the design.
- Net Track Width - the number of net tracks of each width used in the design.
- Net Via Size - the number of net vias of each size used in the design.
- Routing Information - information on routing completion (as a percentage), along with a breakdown of the total number of connections, how many have been routed, and how many remain.
- All On - click this button to quickly include all items in the report (checking their respective check boxes).
- All Off - click this button to quickly exclude all items from the report (unchecking their respective check boxes).
- Selected objects only - enable this option to have the report generate information for each of the include items, but only with respect to design objects currently selected in the design workspace.
- Report - with all items enabled for inclusion into the report as required, click this button to generate the report. The report itself is generated in HTML format (Board Information - <PCBDocumentName>.html).