PCB_Dlg-ReportFormBoard Report_AD

The Board Report dialog

Summary

The Board Report dialog allows you to specify the content to be included when generating a detailed report for the board.

Access

The dialog is accessed in the following ways:

• From the PCB editor, select Reports » Board Information from the main menu.
• Clicking the Reports button at the bottom of the Board Information region of the Properties panel while in Board mode (accessed when no objects are selected in the design space). 

Options/Controls

• Check items that you would like included in the report - this region lists all of the items that can be included in the report. To include information on a particular attribute of the board, ensure its associated box is checked. Supported items for inclusion are:
  • Board Specifications - general information about the board size and the number of components on the board.
  • Layer Information - how many primitives (arcs, pads, vias, tracks, texts, fills, regions, and component bodies) are on each used layer of the board, along with total usage for each primitive type.
  • Layer Pair - the defined drill layer pairs, along with a breakdown of the number of vias starting and stopping between those pairs.
  • Copper Area - the number of layers that contain copper areas for objects (such as board regions, board shapes, and polygon pours), the size of the copper areas (provided in inches and millimeters), and the percentage of copper areas used within each layer.
  • Non-Plated Hole Size - the number of pads and vias for each hole size of this type.
  • Plated Hole Size - the number of pads and vias for each hole size of this type.
  • Non-Plated Slot Size - the number of pads for each slot size of this type.
  • Plated Slot Size - the number of pads for each slot size of this type.
  • Non-Plated Square Holes Size - the number of pads for each hole size of this type.
  • Plated Square Holes Size - the number of pads for each hole size of this type.
  • Top Layer Annular Ring Size - the number of objects (pads and vias) for each annular ring size on the top layer.
  • Mid Layer Annular Ring Size - the number of objects (pads and vias) for each annular ring size on a mid-layer.
  • Bottom Layer Annular Ring Size - the number of objects (pads and vias) for each annular ring size on the bottom layer.
  • Pad Solder Mask - the number of pads for each specified and unique solder mask expansion value.
  • Pad Paste Mask - the number of pads for each specified and unique paste mask expansion value.
  • Pad Pwr/Gnd Expansion - the number of pads associated with unique Clearance values specified in defined power plane clearance rules.
  • Pad Relief Conductor Width - the number of pads associated with unique Conductor Width values specified in defined power plane connect style rules.
  • Pad Relief Air Gap - the number of pads associated with unique Air-Gap values specified in defined power plane connect style rules.
  • Pad Relief Entries - the number of pads associated with unique Conductors values specified in defined power plane connect style rules.
  • Via Solder Mask - the number of vias for each specified and unique solder mask expansion value.
  • Via Pwr/Gnd Expansion - the number of pads associated with unique Clearance values specified in defined power plane clearance rules.
  • Track Width - the number of objects for each unique track width used in the design.
  • Arc Line Width - the number of objects for each unique arc line width used in the design.
  • Arc Radius - the number of objects for each unique arc radius used in the design.
  • Arc Degrees - the number of objects for each unique arc angle used in the design.
  • Text Height - the number of objects for each unique text height used in the design.
  • Text Width - the number of objects for each unique text width used in the design.
  • Polygon Clearance - the number of polygons of each clearance used in the design.
  • Net Track Width - the number of net tracks of each width used in the design.
  • Net Via Size - the number of net vias of each size used in the design.
  • Routing Information - information on routing completion (as a percentage), along with a breakdown of the total number of connections, how many have been routed, and how many remain.
• All On - click to quickly include all items in the report (i.e., check their respective boxes).
• All Off - click to quickly exclude all items from the report (i.e., uncheck their respective boxes).
• Selected objects only - enable to have the report generate information for each of the include items, but only with respect to design objects currently selected in the design workspace.

• Report - with all items enabled for inclusion into the report as required, click this button to generate the report. The report itself is generated in HTML format (Board Information - <PCBDocumentName>.htm).