ViaSize_MidLayer1

Now reading version 20.0. For the latest, read: ViaSize_MidLayer1 for version 21

Parent page: PCB Query Functions - Fields

Summary

Returns via objects whose X Size (Mid Layer 1) property complies with the Query.

Syntax

ViaSize_MidLayer1 : Number

Number will follow the measurement units currently employed for the document – either Imperial (mil; 1mil = 0.001inch) or Metric (mm; 1mm = 0.001meter).

A specific option for the measurement unit can be specified – overriding the default units specified at the document level – through use of an additional measurement unit-based keyword:

  • AsMils(ViaSize_MidLayer1) : Number – to specify a size in mil.
  • AsMM(ViaSize_MidLayer1) : Number – to specify a size in mm.

Example Usage

ViaSize_MidLayer1 = 100
Returns all via objects whose X Size (Mid Layer 1) property is equal to 100 current measurement units.

ViaSize_MidLayer1 >= 4.064
Returns all via objects whose X Size (Mid Layer 1) property is greater than, or equal to, 4.064 current measurement units.

AsMils(ViaSize_MidLayer1) > 80
Returns all via objects whose X Size (Mid Layer 1) property is greater than 80mil.

AsMM(ViaSize_MidLayer1) Between 1.524 And 3.81
Returns all via objects whose X Size (Mid Layer 1) property is greater than or equal to 1.524mm and less than or equal to 3.81mm.

ViaSize_MidLayer1 <> 50
Returns all via objects whose X Size (Mid Layer 1) property is not equal to 50 current measurement units.

Tips

  1. For simple vias (with Stack Mode set to Simple) the X Size (Mid Layer 1) property will be the same as the X Size (All Layers) property, since the specified size is used for all signal layers.
  2. When viewing the properties for a selected via in the Properties panel, the X Size (Mid Layer 1) property corresponds to the Diameter field for Mid Layer 1 (in the Size and Shape section) when the mode is set to Top-Middle-Bottom, or Full Stack. When the mode is Simple, this will correspond to the Diameter field.
  3. The X Size (Mid Layer 1) property is only defined for pad and via objects.

 

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